AAEON’s UP brand rolled out four new platforms built around Intel’s latest “Wildcat Lake” Core processors, slated for mass production in late Q3 2026. The lineup includes two developer boards—UP WCL, a credit‑card‑sized successor to the original UP, and UP Nexus WCL, which adopts the 101.6 mm square Squared Pro form factor. Both also ship as plug‑and‑play edge systems. Production follows Intel’s Series 3 launch, granting silicon access.

Customers can choose Intel Core 7 350, Core 5 320 or, for the smaller UP WCL, Core 3 304 CPUs. Integrated GPU and NPU deliver up to 40 TOPS of AI throughput while low‑power E‑cores keep consumption modest. Memory jumps dramatically: UP WCL ships with 24 GB LPDDR5, Nexus WCL tops out at 48 GB, and both receive 256 GB UFS 3.1 storage for demanding AI models.

The boards retain familiar I/O—UP WCL offers a 10‑pin header for I2C, PWM and SPI, 2.5 GbE and three USB 3.2 Gen 2 ports—while Nexus WCL adds dual 2.5 GbE, USB‑C 3.2 Gen 2x2 and extra 10‑pin RS‑232/422/485 connectors. Both support Windows 11 LTSC and Ubuntu 24.04 LTS, positioning them as ready‑made solutions for AI edge workloads that need higher memory and storage without the power draw of traditional HPC kits.