Tech & Hardware 3 Days

Last updated: June 6, 2026, 5:35 PM ET

Cooling Innovations At Computex 2026, several vendors rolled out next‑generation liquid‑cooling hardware aimed at high‑performance desktops and workstations. Einarex unveiled the HALOX AIO cooler, a 360 mm unit that integrates a brushed‑aluminum radiator and a dual‑pump design to sustain up to 250 W TDP on Intel LGA 1851 platforms, while its Wood‑series Glide G300 and Ventus V300 air coolers target silent builds with fin stacks tuned for 150 mm fans. In parallel, Thermal Grizzly introduced DeltaMate CPU blocks for both AMD AM5 and Intel LGA 1851 sockets, featuring micro‑fin lattices that claim a 12% reduction in coolant flow resistance versus its previous generation. Meanwhile, TRYX launched the holographic HOLO series, a 360 mm AIO that projects a dynamic light pattern from the pump head, and SilverStone displayed the Hail Stone 420, a 420 mm workstation‑class AIO engineered for AMD Threadripper 7000 series, promising a 15% lower delta‑P across its triple‑stage pump. Together, these releases underscore a market shift toward larger radiators and aesthetic integrations as CPU power envelopes climb above 300 W in AI‑focused builds.

Case Design Evolution The show also highlighted a wave of new chassis that blend function with distinctive visual cues. Lian Li refreshed its Lancool and O11 lines, adding tempered‑glass side panels with integrated cable‑management channels that reduce clutter by 30% in measured builds. CASECOM’s flotation‑effect C460A‑01 introduced a horizontal partition that creates a “float” compartment for GPU cooling, while Apeer2’s ITX case ships with a built‑in 7‑inch monitor mount, targeting compact workstations that require on‑board display without sacrificing airflow. Cougar’s AI‑workstation NU‑series and its WS‑series prototype PSUs combine modular power delivery with a 40% increase in VRM cooling capacity, and InWin’s GX‑285 chassis incorporates a 10.1‑inch LCD front panel that can toggle between system stats and custom artwork, a feature that aligns with the growing demand for real‑time telemetry in enthusiast rigs. These designs reflect manufacturers’ attempts to differentiate in a saturated market by adding integrated displays, novel compartmentalization, and higher airflow efficiency.

Power Supply Scaling for AI Power delivery solutions received a substantial upgrade to meet the demands of AI training and high‑end content creation. FSP’s CANNON 3.3 kW model targets AI compute nodes, offering an 80 Plus Platinum rating and a digital control interface that can throttle up to 5% more output under sustained 90% load. Complementing this, ID‑Cooling’s FP‑1000 flagship entered the 1000 W tier with a fully modular design and a proprietary fan‑less cooling system that reduces acoustic output to under 20 dBA at full load. HAVN’s XR series delivered 1200 W Platinum units with a dual‑rail architecture optimized for multi‑GPU configurations, while CPS PCCooler’s SR700 full‑tower PSU pushed the envelope further with a 1500 W capacity and integrated monitoring that logs power spikes in real time. The convergence of higher wattage, digital management, and silent operation signals a clear industry response to the escalating power envelopes of next‑gen GPUs and CPUs.

Memory, Storage and Peripheral Advances Memory and storage vendors used the expo to showcase products that blend speed with novel user interfaces. AGI’s micro SDXC A2 V30 card claimed a sustained 100 MB/s write speed in a form factor traditionally limited to 90 MB/s, while TwinMOS’s Volt X DDR5 kit introduced ARGB lighting synchronized with memory timing profiles, a feature aimed at overclocking enthusiasts. On the SSD front, Team Group’s T‑Force Liquid II M.2 integrated a closed‑loop liquid cooler directly onto the M.2 substrate, delivering 12 GB/s sequential reads and maintaining sub‑30 °C temperatures under 100 W load. V‑Color’s Xfinity+ OLED Manta pushed the envelope further by embedding a 0.5‑inch OLED matrix on the module, enabling real‑time temperature readouts without software. Peripheral updates included Iqunix’s EC75HE keyboard, which employs Hall‑effect magnetic switches rated for 75% faster actuation, and Ducky’s Cushion 98, a low‑profile mechanical board featuring PBT keycaps with a proprietary “soft‑touch” coating that reduces key‑press force by 10%. These innovations illustrate a trend toward tighter integration of performance metrics within the hardware itself, offering users immediate feedback without additional monitoring tools.

Gaming and Creative Platforms High‑end laptops and handhelds also featured prominently, reflecting the continued blurring of mobile and desktop performance. Acer Predator’s Atlas handheld debuted with an Intel Arc G3 E GPU, 8 GB LPDDR5 memory, and a 7‑inch 1080p display capable of 120 Hz refresh, positioning it as a portable solution for 1080p esports titles. XMG’s PRO 18 notebook entered the upper‑mid‑range segment with a 12 GB VRAM RTX 4070 GPU, a 15.6‑inch 240 Hz panel, and a 99 Wh battery that the company claims can sustain 6 hours of continuous gaming. Complementing these, Acer’s Helios 18 AI laptop incorporated a dedicated NPU for on‑device inference, promising up to 2× faster AI‑enhanced image processing compared to CPU‑only equivalents. In the desktop arena, ASRock’s Taichi 360 Holo AIO combined a 3D holographic fan array with a 360 mm radiator, while the ASRock Phantom Gaming RX 9070 XT GPU introduced a 12 V‑2×6 power input to accommodate higher power draws without sacrificing PCB density. These product launches highlight manufacturers’ focus on delivering desktop‑level graphics, AI acceleration, and high‑refresh displays in increasingly compact and portable form factors.