Qualcomm Inc. has agreed to license patents underpinning Huawei Technologies Co.’s novel Logic Folding chipmaking technique, a win for the Chinese company and its push to advance in overseas AI markets. The multiyear deal is part of a cross-license agreement between the two chipmakers, spanning technologies related to 5G devices, AI services, near- and co-packaged optics and networks, a Huawei spokesperson said Monday.
The agreement with Qualcomm helps validate the Shenzhen-based company’s chipmaking capabilities. Huawei sees its new architecture as a breakthrough that boosts semiconductor performance and helps it narrow the gap with industry leaders such as Taiwan Semiconductor Manufacturing Co. That approach focuses on improving data transmission speeds to make up for China’s lack of access to ASML Holding NV’s extreme ultraviolet lithography machines.
Huawei, which unveiled its Logic Folding approach just months ago, is one of a handful of companies seen as key to China’s ambitions to lead in AI and reduce reliance on foreign technology including Nvidia Corp. accelerators. The company did not disclose the value of the cross-license agreement with Qualcomm. The deal is subject to US Federal Trade Commission review under the Hart-Scott-Rodino Antitrust Improvements Act, which applies to deals valued at more than $133.9 million.
Huawei expects the overall contract value of all its patent licensing agreements to exceed $6.9 billion following the deal with Qualcomm, the spokesperson said.
Source: Hacker News · Summarized by HeadlinesBriefing