Intel's senior vice president Cho Min-sung announced at the Semiconductors Powering Humanoids summit in South Korea that the next-generation 'Razor Lake-AX' platform will deliver 700 TOPS of AI compute on die. At INT8/FP8 precision, it will outperform current 'Panther Lake' mobile chips by 3.88 times (180 TOPS), marking a major SoC compute boost from a large integrated GPU and substantial CPU complex. The iGPU will come in two versions: a 16-core and a flagship 32-core variant, both based on Intel's Xe3 graphics IP.
This makes 'Razor Lake-AX' nearly three times as powerful as the current Arc B390. The GPU die is reportedly around 162.84 mm², suggesting a large package with EMIB and Foveros 3D interconnects. Intel also plans to bring back on-package LPDDR5X/LPDDR6 memory, reversing its earlier stance that 'Lunar Lake' was the last design with on-package memory. 'Razor Lake-AX' is expected to arrive in 2028.
উৎস: TechPowerUp News · সারাংশ: HeadlinesBriefing