Supermicro unveiled an expanded Data Center Building Block Solutions lineup, adding Arm‑based servers that run the newly announced Arm AGI CPU and a set of Open Compute Project (OCP) ORv3‑compliant racks. The move targets AI and HPC workloads that demand dense, liquid‑cooled compute while keeping power use low. CEO Charles Liang said the modular approach lets cloud and enterprise operators scale performance‑per‑watt without redesigning whole facilities.

Among the new offerings, a 2U GPU system fits 21‑inch OCP racks and pairs dual Intel Xeon 6700‑series CPUs with an NVIDIA HGX B300 eight‑GPU module linked by 5th‑gen NVLink. A separate FlexTwin chassis houses two independent nodes in a 1‑OU frame, supporting the latest Intel, future AMD and Arm silicon while employing DLC‑2 liquid cooling that can strip up to 90% of generated heat.

The Arm‑based 2U and 5U servers expose up to 136 Neoverse V3 cores, 24 DDR5 DIMM slots for a maximum of 6 TB memory, and eight hot‑swap NVMe bays, offering an I/O‑rich platform for GPU‑intensive AI models. By marrying these processors with Supermicro’s open‑supply‑chain OCP designs, the company aims to simplify deployment for customers ranging from hyperscalers to edge sites, delivering ready‑made, energy‑efficient building blocks today.