SolidRun launches the Bedrock RAI300, the first industrial PC built around AMD's new Ryzen AI 9 HX 370 processor. This fanless, compact x86 device combines Zen 5 CPU cores, a Radeon 890M GPU, and a 50 TOPS NPU for robust edge AI processing, all within a ruggedized chassis.

The system supports AMD's latest ROCm 7 stack, enabling secure local execution of large AI models. It offers up to 128 GB of DDR5 memory and three NVMe slots, providing substantial compute and storage in a modular form factor compatible with existing Bedrock family I/O and power modules.

Designed for extreme environments, the Bedrock RAI300 operates from -40°C to 85°C. Its passive cooling handles up to 60 W, significantly exceeding typical fanless PCs. This makes it suitable for industrial automation, smart infrastructure, and other demanding edge computing applications where reliability is critical.