CXMT is expected to start mass production of its first-ever HBM3E memory by the end of 2026, according to Reuters. This follows risk production that began in August. The company has struggled with low yields, currently reported at only 20%, due to the immaturity of its through-silicon via (TSV) technology.
While JEDEC specs call for speeds between 9.2 Gbps and 12.4 Gbps per pin, CXMT's performance is reportedly closer to SK hynix's previous-generation HBM3. The company is currently shipping two versions to customers: a standard design and an updated version aimed at improving yields. Despite the low production efficiency, domestic chipmakers view this development as critical.
CXMT is unlikely to transition to higher-capacity 12-high HBM stacks in the near term while addressing engineering issues. The firm aims to scale from 8-high to higher configurations as yields improve.
Source: TechPowerUp News · Summarized by HeadlinesBriefing