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ASUS Targets AI Data Center Heat With New Liquid Cooling

TechPowerUp News •
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ASUS is launching ASUS Optimized Liquid-Cooling Solutions and a partner ecosystem to tackle the extreme heat generated by next-generation AI and high-performance computing hardware. The move directly addresses the thermal limits of traditional air cooling as chip power and density skyrocket in modern data centers.

The solutions are engineered specifically for systems like the NVIDIA Vera Rubin NVL72, where accelerator-dense racks overwhelm conventional cooling. By shifting to liquid, ASUS aims to slash energy use, lower Power Usage Effectiveness (PUE), and improve total cost of ownership while enabling far greater rack density than air allows.

Accompanying the hardware is a strategic partner framework designed to streamline deployment and support for enterprise customers. This isn't just a product launch; it's a infrastructure play to position ASUS as a key vendor as the entire industry pivots from air to liquid cooling to sustain AI's computational growth.