Applied Materials is pushing the boundaries of chip technology with new systems designed to boost the performance of advanced logic chips. The company introduced new deposition, etch, and materials modification systems targeting 2nm and beyond. These innovations aim to enhance Gate-All-Around (GAA) transistors, the building blocks of energy-efficient computing needed for more powerful AI chips, as the industry transitions to smaller nodes.

At the heart of these advancements is the new Viva Radical Treatment System. This system enables precision engineering of GAA transistor nanosheets, which are crucial for efficient charge transport. The Viva system utilizes a patented delivery architecture to generate ultrapure radical species, ensuring uniform surface treatments. This precision is essential for faster, more energy-efficient transistors. The Sym3 Z Magnum etch system is also a key part of this, creating angstrom-level 3D trenches.

The Sym3 Z Magnum system features a second-generation pulsed voltage technology (PVT2) to precisely control ion trajectories. This enables the creation of clean, precise trenches. Additionally, new Spectral ALD System lowers contact resistance with selective deposition of molybdenum. These innovations are critical for boosting transistor speed and overall chip performance.

Applied Materials' advancements are designed to help chipmakers accelerate their roadmaps and keep pace with the demands of AI. The new systems are already being adopted by leading logic chipmakers, demonstrating the industry's commitment to pushing the limits of performance. These innovations will be vital for the future of AI compute, and are intended to extend the use of current materials.