Details on AMD's upcoming Ryzen mobile chips, codenamed "Medusa Point," have surfaced. Shipping documents reveal a "Medusa 1 A0" microprocessor with a 28W TDP (Thermal Design Power) rating. This suggests AMD is still testing and validating these designs. The "A0" designation indicates early-stage silicon samples meant for internal assessment.

This information aligns with a prior report from late 2025, which also mentioned a 45W TDP version. The "Medusa Point" chips are expected to feature a "4C4D" core layout, which suggests a configuration of four standard cores and four dense cores. This design is likely aimed at maximizing performance while keeping power consumption low, ideal for laptops.

Reports suggest the new chips won't arrive until 2027. AMD is preparing "Gorgon Point" (Zen 5/RDNA 3.5) for an imminent launch in the meantime. The "Medusa Point" APUs are expected to integrate "RDNA 3.5+" iGPUs, rather than truly next-generation graphics.

So, what's next? We can expect further leaks as AMD refines these mobile processors. Keep an eye out for more specific details about core counts, integrated graphics capabilities, and the eventual launch timeline. The mobile space is hotly contested, and AMD wants to stay competitive.