Intel unveiled its new Core Series 3 mobile CPUs aimed at budget laptops and edge devices. Built on the 18A process, the most advanced logic node made in the United States, these chips inherit architecture from the Panther Lake Ultra line. Availability begins today, April 16, 2026, with OEMs shipping systems soon. The chips target devices priced under $600, aiming to give affordable machines AI capabilities previously reserved for premium models.

Performance claims center on single‑thread gains of up to 47% and multi‑thread improvements of 41% versus five‑year‑old PCs, while GPU‑AI throughput jumps 2.8×. The silicon supports up to 40 TOPS of AI acceleration, two Thunderbolt 4 ports, Intel Wi‑Fi 7 (R2) and Bluetooth 6. Battery life targets 2.1× faster productivity with 64% lower power draw, making them competitive for budget‑conscious creators.

Intel positions the line for schools, small firms and “essential edge” gear such as POS terminals and smart meters. Compared with NVIDIA’s Jetson Orin Nano, the Core 7 350 variant promises 1.5× better object detection and up to 2.2× faster video analytics. With more than 70 partner designs slated, the rollout promises a broad, price‑focused ecosystem.