A leaked motherboard image posted by WhyLab and Ice Universe shows the iPhone 18 Pro and Pro Max will ship with Apple’s next‑generation A20 Pro chip. The diagram highlights a shift to a wafer‑level multi‑chip module (WMCM) packaging method, a departure from the integrated fan‑out (InFO) approach used on the A19 series. Engineers expect the change to boost raw performance while keeping temperatures lower.

WMCM spreads chiplets laterally instead of stacking DRAM atop the processor, widening the heat‑dissipation area and reducing throttling risk. The layout preserves InFO‑level latency, but the side‑by‑side placement lets Apple mix and match smaller dies, cutting waste. Ice Universe adds that the A20 will pair with 96‑bit LPDDR6 memory, a 50 % bandwidth jump over the prior 64‑bit LPDDR5, and an enlarged Neural Engine for AI.

Apple keeps the A20’s footprint roughly equal to the A19 Pro, so the iPhone 18 Pro won’t grow larger despite the new architecture. Side‑mounted memory and chiplet modularity should lower production waste and trim costs, while the cooler thermal envelope promises sustained peak speeds during gaming or AI workloads. Buyers can expect a faster, more reliable flagship without a bulkier chassis.