The upcoming A20 Pro chip for the iPhone 18 Pro and iPhone Ultra is rumored to feature two significant upgrades. Firstly, it will be the first iPhone chip to utilize TSMC's 2-nanometer process. This advancement from the current 3nm process is expected to deliver increased power and improved efficiency within a similar chip size.

Secondly, the A20 Pro is anticipated to incorporate Wafer-Level Multi-Chip Module (WMCM) packaging. This innovation allows for the integration of components like the SoC and DRAM at the wafer level, before they are separated into individual chips. This direct die-to-die connection, without an interposer or substrate, is expected to enhance performance and reduce power consumption, particularly for AI tasks, aligning with the AI-centric nature of iOS 27.

These combined advancements in fabrication and packaging suggest a substantial leap in performance and efficiency for Apple's next-generation mobile processors.