BE Semiconductor (Besi) reported fourth-quarter revenue of €166.4 million, up 25.4% sequentially and 8.5% year over year, driven by strong demand for AI-related packaging and photonics applications. Orders surged to €250.4 million, more than doubling from the prior year, as Asian subcontractors increased capacity purchases for 2.5D datacenter applications and hybrid bonding.

Gross margin improved to 63.9%, up 1.7 percentage points from the previous quarter, supported by a favorable product mix. Net income reached €42.8 million with a margin of 25.7%, though both figures declined year over year due to higher year-ago comparisons. The company attributed growth to renewed photonics capacity investments and rising hybrid bonding orders.

For the first quarter of 2026, Besi projects revenue growth of 5-15% from Q4 levels, with gross margin expected between 63% and 65%. Operating expenses are forecast to rise 10-15% to €50-57.5 million, primarily due to increased research and development spending. The strong order book and AI-driven demand position the semiconductor equipment maker for continued expansion in the current quarter.