Suppliers are expanding DRAM output, yet Nikkei Asia projects they will satisfy only 60 % of global demand by the close of 2027. Even SK Group chairman warns the deficit could linger until 2030. The three dominant makers—Samsung, SK Hynix, and Micron—have announced new fabs, but most won’t ship chips before 2027, leaving consumer markets exposed and pricing volatile.

To bridge the gap, production would need to climb roughly 12 percent annually in 2026 and 2027, according to Nikkei. Counterpoint Research, however, sees only a 7.5 % increase on the horizon. New lines are being tuned for high‑bandwidth memory, the premium substrate that powers AI data centers for cloud providers, rather than the general‑purpose DRAM found in phones and laptops.

Because manufacturers are prioritizing HBM, the influx of fresh capacity does little to ease the price pressure on consumer electronics. Phones, laptops, VR headsets and handheld gaming rigs have all seen cost spikes as RAM scarcity tightens supply chains. Until the delayed fabs come online, manufacturers and shoppers alike will continue to feel the squeeze for both OEMs and end users.