Terafab, the chip venture between Tesla and SpaceX, aims to produce 1 million wafers per month by 2032, with 700,000 for memory and 300,000 for logic, according to Nikkei. That output would be 40 times Japan's Rapidus project.
A Jiji Press report last month said a single Texas plant would handle both, with a pilot fab by July 2027. Intel is assisting logic with 2 nm and 1.4 nm-class tech, while a Taiwanese firm — possibly Nanya — may partner on memory. For scale, Samsung's DRAM output was 650,000–700,000 wafers/month late last year; SK hynix was at ~550,000 and targets ~1 million by 2030–31.
Elon Musk cautioned on an October SpaceX call that volume production by Q3 2028 carries "big error bars," with a first SRAM test chip slated for mid-2027 at Terafab's Austin lab. Filings show the full build-out could cost up to $119 billion, and TSMC held talks about joining. However, Terafab's chips are earmarked for Musk's robots, cars, and data centers first, so consumer DRAM relief remains distant.
Source: TechPowerUp News · Summarized by HeadlinesBriefing