GlobalFoundries is re-entering the advanced-node race with its new FDX Fusion technology, a 7 nm-class semiconductor solution based on fully-depleted silicon-on-insulator (FD-SOI) architecture. After halting 7 nm development in 2018 due to rising costs and manufacturing complexity, the company now offers a unique approach with a fully insulating layer beneath the channel, enabling ultra-low-power in-memory computing and seamless integration of embedded non-volatile memory like eMRAM. FDX Fusion delivers 7 nm-class characteristics and twice the transistor density of the first-generation 22FDX node. Mass production is planned for 2028 at the company's advanced facility in Dresden, Germany, supporting European chip sovereignty.
Initial technology demos will be available next year, with PDK shipping in mid-2027. The technology targets specialized applications in physical AI, automotive, and ASIC markets requiring heavy computation and sensing capabilities.
Source: TechPowerUp News · Summarized by HeadlinesBriefing