Huawei announced plans to launch the Mate XT2 and Mate X9 in the second half of 2024, both powered by the forthcoming Kirin 9050 Pro chipset that rivals 3nm performance even though it will not be built on a 3nm node.

The Mate XT2 will refine the tri‑fold mechanism of the original XT series, while the Mate X9 will feature a 6.5‑inch cover display and an 8.15‑inch inner screen, eclipsing the 8.0‑inch inner of the Mate X7. Its battery will exceed 6,000m Ah, compared to the X7’s 5,600m Ah. Camera upgrades include a 1/1.3‑inch main sensor and a telephoto module, and the device is priced around CNY 10,000 ($1,475/€1,290/₹140,500), a noticeable drop from the Mate X7’s base price of CNY 13,000.

Huawei’s dual‑fold strategy signals a bid to capture the premium foldable segment, but the high price tags—CNY 18,000 for the XT series—may curb mass adoption. The move also pressures competitors to accelerate their own foldable innovations to stay competitive.