Apple's iPhone Fold faces manufacturing setbacks with circuit board assembly problems slowing production, according to Weibo leaker Fixed Focus Digital. The foldable device's Surface Mount Technology (SMT) is proving problematic, described as "not optimistic" in the latest supply chain report. Apple's ambitious foldable project continues to face engineering challenges as it approaches potential launch.

SMT, a method for building printed circuit boards without drilled holes, is causing delays for Apple's ambitious foldable project. The technique involves attaching components to boards using solder paste on copper pads, which must be heated to create soldered connections. Mass production challenges continue to plague the iPhone Fold development, with the flexible design and complex hinge system presenting significant technical hurdles.

This follows previous reports about hinge issues for the iPhone Fold, with conflicting claims about the reliability of Weibo-based rumors. Fixed Focus Digital has a mixed track record, correctly predicting the iPhone 16e name but incorrectly forecasting its market performance. The repeated manufacturing setbacks suggest Apple may need to reconsider its timeline for the foldable device's release.