Another day, another teardown - the first blog post of 2026 examines the BMW IDC23H infotainment unit manufactured by Harman Becker. Found in the new X1 U11 SUV, the IDC23H follows the MGU22/MGU22H design and represents a joint venture between Harman Becker and Garmin (the 'H' suffix denotes Harman production). Connectivity includes APIX links to the Driver Camera System (DCS), Heads-Up Display (HUD), and Driver's Display (DFE), plus Wi-Fi 6, Bluetooth 5.0, GNSS, 100BASE-T1/1GBASE-T1 Ethernet, AR-CAM, and USB. Notably, the DFE connection drives the instrument cluster, suggesting BMW has eliminated the dedicated KOMBI module.

Basic specs: Qualcomm Snapdragon SA8155 processor, 12GB LPDDR4 RAM, Infineon TRAVEO CYT3BB Cortex-M7 interface processor, 128GB UFS v3.1 storage. The unit comprises two PCBs: a main board and a new APIX connectivity PCB (labeled Garmin 105-04748-00) hosting dual Inova APiX 3 transmitters and a MAX96714 deserializer. The main PCB (Garmin 105-04747-00) features a Delta Electronics forced-air heatsink cooling the Snapdragon module. An unpopulated second 100-pin connector hints at future expansion.