Intel's "Nova Lake-H" SoC, part of the Core Ultra 4000 Series, has reportedly surfaced. This variant features a 4+8+4 configuration with 4 P-Cores, 8 E-Cores, and 4 LPE-Cores on a compute die made using Intel 18A-P technology. The package measures about 12x23 mm, resulting in a total die area of 276 mm², and includes both functional and dummy dies.
The first die is the graphics tile, built on the Intel 3-E node, embedding 4 Xe GPU cores and covering roughly 26 mm². Next to it is a dummy die occupying 21 mm², used for the structural integrity of the package. There is also a large 72 mm² die built on the Intel 18A-P node, hosting 4 LPE-Cores and serving as a central hub.
Beside it is another 18A-P silicon die that functions as a peripheral control tile, measuring 58 mm². This configuration includes a compute tile, which hosts a 4P+8E-core configuration on the Intel 18A-P node, occupying 55 mm² of area. Based on previous rumors, Intel's new four-digit Core Ultra 4000 naming isn't limited to desktop chips.
We might see these "Nova Lake-H" (and "Nova Lake-HX") laptop processors using the same four-number format. It will be interesting to see how Intel distinguishes these series from the older ones, and especially how the four-digit naming differs from the three-digit format used in prior generations.
Source: TechPowerUp News · Summarized by HeadlinesBriefing