GlobalFoundries announced it will operate two new semiconductor fabs at its Malta, New York site under a U.S.-Japan initiative involving up to $21 billion in funding. The first 300 mm fab will receive an initial $10 billion investment, with groundbreaking expected later this year and production slated to begin in 2029. A second fab is planned for a later date with another $10 billion investment.
Each fab is expected to produce around 900,000 wafers annually when fully operational. GF projects baseline capacity for the first fab around 2031 and the second by 2033. The expansion supports GF’s push into advanced packaging and semiconductor manufacturing.
In April, AMD announced plans to collaborate with GF on co-packaged optics (CPO) for its Instinct MI500 AI accelerators, targeting 2027. GF is also preparing to bring its 7 nm-class FDX Fusion technology into mass production at its Dresden, Germany facility in 2028. Separately, GF amended its CHIPS and Science Act award with the U.S. Department of Commerce, reallocating $955 million to advance silicon photonics, silicon-germanium (SiGe), and advanced packaging in Malta, New York, and Burlington, Vermont.
Under the agreement, the U.S. government will receive an approximately 4% equity stake. In 2025, GlobalFoundries ranked fifth among the world’s top ten foundries, behind TSMC, Samsung, SMIC, and UMC.
Source: TechPowerUp News · Summarized by HeadlinesBriefing