Cooler Master, a global leader in digital infrastructure cooling solutions, has outlined its end-to-end cooling portfolio for AI infrastructure, designed to support high-density computing deployments in new data centers and existing facilities expanding AI capacity. Anchored by a 2,500 kW Liquid-to-Liquid In-Row Coolant Distribution Unit (CDU), the portfolio spans facility-level heat transfer, rack and server cooling, and the equipment used to prepare liquid cooling systems for operation.
Thomas Chen, CEO at Cooler Master Corporation, said customers need choices that bring fast time-to-market, flexibility, and scalability. "We aim to help them put liquid cooling to work, whether that means retrofitting an existing data center or building a new site," Chen said. "That requires comprehensive plans about how the equipment being assembled, installed, and serviced."
The 2,500 kW CDU is designed to meet the thermal demands of rapidly expanding AI and HPC infrastructure. It delivers up to 2,500 MW of cooling capacity at 990 GPM with a 4-5°C approach temperature difference, allowing operators to support larger AI clusters, higher rack densities, and future growth. Dual-system architecture, intelligent load balancing, and centralized management supporting up to 32 interconnected CDUs provide the scalability and resilience required for mission-critical deployments. Mass production is targeted for Q4 2026.
Cooler Master says its ecosystem covers every stage of deployment, from system preparation, filling and commissioning to CDU platforms, custom piping and secondary-loop technologies for direct-to-chip cooling. The company's liquid-to-liquid CDUs range from 150 kW to 2,500 kW. Cooler Master will exhibit at OCP Global Summit 2026 at Booth A14, San Jose McEnery Convention Center, October 13-15.
Source: TechPowerUp News · Summarized by HeadlinesBriefing