Intel has already begun adopting high-NA EUV machines in chip manufacturing. The US company has used the technology in high-volume manufacturing of Panther Lake processors for mobile computing devices starting in July 2026.

Samsung and TSMC are also now working with Intel and ASML to change the chipmaking standard for photomasks from 6-inch to 12-inch. That shift could improve productivity of high NA EUV machines by 40 percent, ASML chief technology officer Marco Pieters told Bloomberg. SK Hynix is considering joining the consortium, aiming to make memory chips using high NA EUV starting in 2028.

Improved production has become imperative as the AI bubble inflates, with a global memory chip shortage raising prices. ASML's machines are key in US-China tech competition; ASML supplies SMIC with older machines but is blocked from exporting most under Dutch restrictions. China faces an uphill battle, with Zeiss predicting 15 years to develop EUV machines.