To make the iPhone Duo as thin as possible, Apple implemented aggressive thermal management innovations. In an interview with PCMag, Apple's VP of silicon engineering Dan Murray and senior manager of thermal product design Banafsheh Barabadi detailed the engineering choices. The A20 Pro chip features a new "M-Class-inspired packaging design" that moves the DRAM module next to the processor using a wafer-level multichip module (WMCM) technique, spreading heat rather than confining it.
A thermal redesign of the vapor chamber offers three times the surface area and uses more de-ionized water. A "Metal over foam" layer creates compliant coupling between the chamber and chip. Additionally, a nanotube copper display metal plate provides mechanical strength and high thermal conductivity.
These four pillars of heat management allow the device to maintain desktop-like performance despite its slim profile.
Source: AppleInsider · Summarized by HeadlinesBriefing