Apple's iPhone 18 Pro is set to feature the next-generation N2 wireless chip alongside the C2 modem, continuing the company's push into in-house silicon. Analyst Jeff Pu reports that the flagship device will launch this fall with both chips, building on Apple's recent success with the C1 modem and N1 wireless chip.

Apple's silicon strategy has expanded far beyond its main processors. The C1 modem debuted in iPhone 16e with unexpected benefits like improved battery life and better performance in congested data spots. The C1X variant later doubled speeds in the iPhone Air and M5 iPad Pro. The N1 wireless chip combined Wi-Fi 7, Bluetooth 6, and Thread connectivity while enhancing features like Personal Hotspot and AirDrop.

While specific details about the N2 chip remain unknown, Apple's track record suggests meaningful improvements are coming. The company has already demonstrated its ability to build surprise benefits into its C-class modems in a short timeframe. Taking greater control of the iPhone's tech stack appears to be creating opportunities for new features and enhancements. With the N2 and C2 chips on the horizon, Apple's silicon team continues to push boundaries in areas traditionally handled by third-party components.