Broadcom expects to sell 1 million 3D stacked chips by 2027, marking a major expansion of its AI chip business. The company has spent five years developing its chip-stacking technology, which allows two silicon pieces to be tightly bound together, improving data flow speed between components.

The forecast represents a potential revenue stream worth billions as demand for AI computing power surges. Fujitsu is already testing engineering samples of Broadcom's first stacked chip design, with plans to begin production later this year. The million-chip projection includes multiple designs beyond Fujitsu's initial product.

Broadcom's approach gives customers the ability to build more powerful chips that use less energy for AI workloads. The company works with major tech firms like Google and OpenAI to design custom processors, positioning itself as a key competitor to Nvidia and AMD in the AI chip market. With projected AI chip revenue of $8.2 billion for its first fiscal quarter, Broadcom's stacked chip technology could become a significant differentiator in the race to meet growing AI computing demands.